The Multicore® line of solder pastes is designed to meet the rigorous demands of a variety of electronic manufacturing soldering processes.

MultiCore Catalog Pages

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Cleaners........................

No Clean Fluxes...................................
Lead-Free LF318 Solder Paste...
Cored Wire......................
VOC-Free Fluxes/Water Washed Fluxes
Other Solder Paste Products.........
Loctite Electronic Adhesive.
MP218 Solder Paste.............................
Other Lead Free Products.........

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Champ, Inc.

Botron ESD Products
Degreasers - Excelta Industrial Tools
atic Loctite-Multicore Solder Material

Solder - Pace Soldering equipment and accessories

Synthetic Lubricants - MicroCare Solvents and tools for cleaning
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Product Catalogs

Hand Tools
Cleaners, Flux Removers, Stencil Wipes
Solder Equipment and Accessories
Static Control
Specialty Stocked Items
CTI-140Meiji Techno Zoom Microscope
MP218/LF318 (lead Free)Solder Paste
Electronic Adhesives
For Engineers Only
Articles and Case Studies
Supplier Links
Botron
Excelta

Fancort

Multicore
Loctite
MicroCare
Pace WorldWide
 

Technical Data
-MP218 Tech Data Sheet
-MP218 MSDS Sheet
-LF318 Tech Data Sheet
-LF318 MSDS Sheet
-29840 Resin MSDS Sheet
-29840 Hardener MSDS Sheet
 
 
 

 

 

 

 

 

 
 





What we do:  2006  Production supply distributor; vendor; manufacturer authorized reseller.  Products:  ESD (anti static control and elimination products and services, anti static wrist straps, heel grounders, test equipment, anti static mats, tapes and signs), soldering/desoldering systems, SMT and BGA components, Fume extraction systems, precision hand tools, Modular work solutions, environmentally safe cleaning solutions (degreasers, defluxers, presaturated and dry wipes), Microscopes, inspection solutions, video capture systems, calipers, maglite, wire shelves and carts, screwdrivers, Torx wrench, hex driver, nut driver, pozidriv, gloves, adhesives (thermally and electrically conductive), liquid encapsulant dam and fill, optoelectronic material, photonic component, assembly materialas, phase change thermal interface, conformal coatings, flip chip on board underfill, liquid encapsulant glob top, silicone encapsulants, gasketing compound, semiconductor molding component, CSP underfill, flip chip in package underfill, coating powder, electronic molding compound, potting compounds, solder paste, flux, wire solder. labels, electronics, industrial, printing systems and technical support.  Services:  complete electronics soldering training to IPC standards including rework and repair and modification,  advanced SMT rework, and   Process training.

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