Meiji Techno Zoom Stereo Microscope    

Meiji Techno Zoom Stereo Microscope (CTI-140)with adjustable focus block, individual focusing eyepieces, continuous zoom from 4x to 22x.

Annular fiber optic light source included as well as heavy duty adjustable boom stand. This configuration is ideal for circuit board soldering and inspection. It allows enough room from bottom of scope head to work surface for tools and soldering irons. Other configurations available including different zoom ranges, Trinocular setup for video capture and multi-person image viewing as well as other stand and focus block options to customize the configuration to your needs.

 

 

Champ, Inc.

Botron ESD Products
Degreasers - Excelta Industrial Tools
atic Loctite-Multicore Solder Material

Solder - Pace Soldering equipment and accessories

Synthetic Lubricants - MicroCare Solvents and tools for cleaning
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Product Catalogs

Hand Tools
Cleaners, Flux Removers, Stencil Wipes
Solder Equipment and Accessories
Static Control
Specialty Stocked Items
CTI-140Meiji Techno Zoom Microscope
MP218/LF318 (lead Free)Solder Paste
Electronic Adhesives
For Engineers Only
Articles and Case Studies
Supplier Links
Botron
Excelta

Fancort

Multicore
Loctite
MicroCare
Pace WorldWide
 

 

 

 

 

 
 





What we do:  2006  Production supply distributor; vendor; manufacturer authorized reseller.  Products:  ESD (anti static control and elimination products and services, anti static wrist straps, heel grounders, test equipment, anti static mats, tapes and signs), soldering/desoldering systems, SMT and BGA components, Fume extraction systems, precision hand tools, Modular work solutions, environmentally safe cleaning solutions (degreasers, defluxers, presaturated and dry wipes), Microscopes, inspection solutions, video capture systems, calipers, maglite, wire shelves and carts, screwdrivers, Torx wrench, hex driver, nut driver, pozidriv, gloves, adhesives (thermally and electrically conductive), liquid encapsulant dam and fill, optoelectronic material, photonic component, assembly materialas, phase change thermal interface, conformal coatings, flip chip on board underfill, liquid encapsulant glob top, silicone encapsulants, gasketing compound, semiconductor molding component, CSP underfill, flip chip in package underfill, coating powder, electronic molding compound, potting compounds, solder paste, flux, wire solder. labels, electronics, industrial, printing systems and technical support.  Services:  complete electronics soldering training to IPC standards including rework and repair and modification,  advanced SMT rework, and   Process training.

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